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In PCBA processing, testing probe technology is a key process used to detect the connectivity and functionality on the circuit board, ensuring the quality and reliability of the circuit board. This article will delve into the testing probe technology in PCBA processing, including its definition, working principle, application scenarios, and advantages.

In PCBA processing (Printed Circuit Board Assembly), high temperature solder is a key material that directly affects the welding quality and the reliability of the circuit board. This article will explore the high temperature solder in PCBA processing, introduce its role, types and advantages, and precautions in practical applications.

Customer feedback is undoubtedly a crucial factor when choosing a suitable PCBA (Printed Circuit Board Assembly) factory. Good customer feedback can provide valuable information about a factory's service, product quality, and delivery capabilities, helping you make a more informed decision. This article will explore how to use customer feedback to select the right PCBA factory.

The typical turnaround time for circuit board assembly produced through contract electronic manufacturing can vary depending on several factors, such as the complexity of the assembly, the quantity of boards required, and the specific requirements of the project. Generally, the lead time for simple and small scale projects with fewer components and simple designs is 2 to 3 weeks. For more complex projects with higher component count, special requests for the manufacturing process, or any extra testing, the lead time could be 4 to 6 weeks or more. However, many contract electronic manufacturing service providers offer a rush service with accelerated delivery times of 1 to 2 weeks for an extra fee.

PCBA processing (Printed Circuit Board Assembly) is a key link in the production of modern electronic products. In order to ensure that your products are competitive in the market, quality control in PCBA processing is essential. This article will discuss in detail how to ensure that the quality of PCBA processing meets your product standards through effective measures.

When the semiconductor industry is gradually entering the Post-Moore-era, wide band-gap semiconductors are on the historical stage, which is considered an important area of "exchanging overtaking". It is expected that in 2024, the wide band-gap semiconductor materials represented by SiC and GaN will continue to be applied in scenarios such as communications, new energy vehicles, high -speed rail, satellite communications, aerospace and other scenarios, and will be used. The application market achieves rapidly. The maximum application market for silicon carbide (SiC) devices is in new energy vehicles, and it is expected to open the tens of billions of markets. The ultimate performance of the silicon base is better than the silicon substrate, which can meet the application requirements under the conditions such as