Product Description

How to Design a Functional Test Method for Air Fryer PCBA

Unixplore Electronics has been committed to the development and manufacturing of high-quality Air Fryer PCBA in the form of OEM and ODM type since 2011.

To ensure the long-term stable operation of a To ensure the long-term stable operation of a Air Fryer PCBA, several aspects can be addressed:

Designing a functional test method for Air Fryer PCBA is a crucial step in ensuring its normal operation and functionality. The following are the general steps for designing a functional test method for an Air Fryer PCBA:

Functional Test Plan: First, determine the functions to be tested, such as heating, fan control, temperature adjustment, timers, etc. Develop a detailed functional test plan to ensure coverage of all designed functions.

Test Equipment Preparation: Prepare the necessary test instruments and equipment for the Air Fryer PCBA's functional testing, such as thermometers, voltmeters, ammeters, etc., to monitor and record test results.

Electrical Testing: Perform electrical tests to check the circuit connections for proper function, and ensure that voltage and current meet design requirements, ensuring that all circuit components are working correctly.

Heating Function Test: Test the heating function of the Air Fryer PCBA, including setting the temperature and heating time, ensuring that the heating element is working properly and reaches the expected temperature.

Fan Control Test: Test the fan's start/stop and speed control functions, ensuring that the fan is working properly and that the speed can be adjusted as needed.

Temperature Adjustment Test: Test the accuracy of the temperature sensor and the temperature adjustment function of the control board, ensuring accurate temperature control during the heating process.

Timer Function Test: Test the timer function, including setting the time, start and stop times, to ensure the timing function is normal and reliable.

Safety Protection Test: Test safety protection functions, such as overheat protection and short circuit protection, to ensure that heating can be stopped promptly in abnormal situations to protect equipment and user safety.

Data Recording and Analysis: Record test data, analyze test results, identify potential problems, and adjust and correct the Air Fryer PCBA.

Test Report: Write a detailed test report, recording the test process, results, and problems found, to provide a reference for further optimization and improvement of the Air Fryer PCBA.

Unixplore provides one-stop turnkey service for your EMS and PCB assembly projects. Feel free to contact us for your board building, we can make a quotation in 24 hours after we receive your Gerber file and BOM list!

Air Fryer PCBA Manufacture

* Gerber file and BOM list supplied by client
* Bare PCB produced, components purchased by us
* PCB fabrication with parts fully assembled
* 100% Functionally Tested OK prior to shipping
* RoHS compliant, Lead-free manufacturing process
* Quick delivery, with independent ESD package
* One stop electronic manufacturing service for PCB design, PCB layout, PCB manufacture, components procurement, PCB SMT and DIP assembly, IC programming, function test, packaging and delivery

Unixplore PCB & PCB Assembly Capability

Parameter	Capability
Layers	1-40 layers
Assembly Type	Through-Hole (THT), Surface Mount (SMT), Mixed (THT+SMT)
Minimum Component Size	0201(01005 Metric)
Maximum Component Size	2.0 in x 2.0 in x 0.4 in (50 mm x 50 mm x 10 mm)
Component Package Types	BGA, FBGA, QFN, QFP, VQFN, SOIC, SOP, SSOP, TSSOP, PLCC, DIP, SIP, etc.
Minimum Pad Pitch	0.5 mm (20 mil) for QFP, QFN, 0.8 mm (32 mil) for BGA
Minimum Trace Width	0.10 mm (4 mil)
Minimum Trace Clearance	0.10 mm (4 mil)
Minimum Drill Size	0.15 mm (6 mil)
Maximum Board Size	18 in x 24 in (457 mm x 610 mm)
Board Thickness	0.0078 in (0.2 mm) to 0.236 in (6 mm)
Board Material	CEM-3,FR-2,FR-4, High-Tg, HDI, Aluminum, High Frequency, FPC, Rigid-Flex, Rogers, etc.
Surface Finish	OSP, HASL, Flash Gold, ENIG, Gold Finger, etc.
Solder Paste Type	Leaded or Lead-Free
Copper Thickness	0.5OZ – 5 OZ
Assembly Process	Reflow Soldering, Wave Soldering, Manual Soldering
Inspection Methods	Automated Optical Inspection (AOI), X-ray, Visual Inspection
Testing Methods In-House	Functional Test, Probe Test, Aging Test, High and Low Temperature Test
Turnaround Time	Sampling: 24 hours to 7 days, Mass Run: 10 - 30 days
PCB Assembly Standards	ISO9001:2015; ROHS, UL 94V0, IPC-610E class ll

Unixplore Value-Added EMS Service

● IC pre-programming service with file in format of HEX,ELF and BIN.
● Air Fryer PCBA Functional test fixture customized according to client’s test requirements
● Box building service including plastic & metal case mold and part production
● Conformal coating including selective lacquer coating, epoxy resin potting
● Wire harness and cable assembly
● Finished product assembly including box, screen, membrane switch, labelling and customized carton or retail box packing.
● Various third-party tests for PCBA are available upon request
● Product Certification Assistance

PCBA Production Procedure