| Parameter | Capability |
| Assembly Type | Through-Hole (THT), Surface Mount (SMT), Mixed (THT+SMT) |
| Minimum Component Size | 0201 |
| Maximum Component Size | 2.0 in x 2.0 in x 0.4 in (50 mm x 50 mm x 10 mm) |
| Component Package Types | BGA, FBGA, QFN, QFP, VQFN, SOIC, SOP, SSOP, TSSOP, PLCC, DIP, SIP, etc. |
| Minimum Pad Pitch | 0.5 mm (20 mil) for QFP, QFN, 0.8 mm (32 mil) for BGA |
| Board Material | CEM-3,FR-2,FR-4, High-Tg, HDI, Aluminum, High Frequency, FPC, Rigid-Flex, Rogers, etc. |
| Surface Finish | OSP, HASL, Flash Gold, ENIG, Gold Finger, etc. |
| Solder Paste Type | Leaded or Lead-Free |
| Assembly Process | Reflow Soldering, Wave Soldering, Manual Soldering |
| Inspection Methods | Automated Optical Inspection (AOI), X-ray, Visual Inspection |
| Testing Methods In-House | Functional Test, Probe Test, Aging Test, High and Low Temperature & Humidity Test |
| Turnaround Time | Sampling: 24 hours to 7 days, Mass Run: 10 - 30 days |
| PCB Assembly Standards | ISO9001:2015; ROHS, UL 94V0, IPC-610E class ll |



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