Unixplore Electronics has been committed to the development and manufacturing of high-quality Air conditioner PCBA in the form of OEM and ODM type since 2011.
To improve the first-pass rate of SMT soldering for Air Conditioner PCBA, i.e., to improve soldering quality and yield, consider the following:
Optimize Process Parameters: Set appropriate process parameters for SMT equipment, including temperature, speed, and pressure, to ensure a stable and reliable soldering process and avoid soldering defects caused by heat or speed.
Check Equipment Status: Regularly inspect and maintain SMT equipment to ensure normal and stable operation. Replace aging components promptly to ensure normal equipment operation.
Optimize Component Placement: When designing the SMT assembly process, rationally place components, considering the spacing and orientation between components to reduce interference and errors during Air Conditioner PCBA soldering process.
Precise Component Placement: Ensure accurate component placement and positioning, using appropriate amounts of solder paste and SMT equipment for precise soldering.
Enhance Employee Training: Provide professional training to operators to improve their SMT soldering techniques and operational skills, reducing operational errors and soldering quality problems.
Strict Quality Control: Introduce strict quality control standards and processes, comprehensively monitor and inspect soldering quality, and promptly identify, adjust, and correct problems.
Continuous Improvement: Regularly analyze quality issues and causes of defects during the welding process, implement continuous improvements, optimize processes and procedures, and increase soldering yield and product quality.
By comprehensively considering and implementing the above measures, the yield of SMT soldering for Air Conditioner PCBA can be effectively improved, ensuring the stability and reliability of soldering quality and product quality.
| Parameter | Capability |
| Layers | 1-40 layers |
| Assembly Type | Through-Hole (THT), Surface Mount (SMT), Mixed (THT+SMT) |
| Minimum Component Size | 0201(01005 Metric) |
| Maximum Component Size | 2.0 in x 2.0 in x 0.4 in (50 mm x 50 mm x 10 mm) |
| Component Package Types | BGA, FBGA, QFN, QFP, VQFN, SOIC, SOP, SSOP, TSSOP, PLCC, DIP, SIP, etc. |
| Minimum Pad Pitch | 0.5 mm (20 mil) for QFP, QFN, 0.8 mm (32 mil) for BGA |
| Minimum Trace Width | 0.10 mm (4 mil) |
| Minimum Trace Clearance | 0.10 mm (4 mil) |
| Minimum Drill Size | 0.15 mm (6 mil) |
| Maximum Board Size | 18 in x 24 in (457 mm x 610 mm) |
| Board Thickness | 0.0078 in (0.2 mm) to 0.236 in (6 mm) |
| Board Material | CEM-3,FR-2,FR-4, High-Tg, HDI, Aluminum, High Frequency, FPC, Rigid-Flex, Rogers, etc. |
| Surface Finish | OSP, HASL, Flash Gold, ENIG, Gold Finger, etc. |
| Solder Paste Type | Leaded or Lead-Free |
| Copper Thickness | 0.5OZ – 5 OZ |
| Assembly Process | Reflow Soldering, Wave Soldering, Manual Soldering |
| Inspection Methods | Automated Optical Inspection (AOI), X-ray, Visual Inspection |
| Testing Methods In-House | Functional Test, Probe Test, Aging Test, High and Low Temperature Test |
| Turnaround Time | Sampling: 24 hours to 7 days, Mass Run: 10 - 30 days |
| PCB Assembly Standards | ISO9001:2015; ROHS, UL 94V0, IPC-610E class ll |
1. Automatic solderpaste printing
2. solderpaste printing done
3. SMT pick and place
4. SMT pick and place done
5. ready for reflow soldering
6. reflow soldering done
7. ready for AOI
8. AOI inspection process
9. THT component placement
10. wave soldering process
11. THT assembly done
12. AOI Inspection for THT assembly
13. IC programming
14. function test
15. QC Check and Repair
16. PCBA conformal coating Process
17. ESD packing
18. Ready for Shipping
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