Unixplore Electronics has been committed to the development and manufacturing of high-quality Paper Shredder PCBA in the form of OEM and ODM type since 2011.
	
When selecting electronic components for a Paper Shredder PCBA, the following points should be considered:
	
Functional Requirements: First, determine the functions the paper shredder PCBA needs to perform, including start, stop, reverse, and overload protection. Then, select appropriate components based on these functional requirements.
	
Performance Requirements: Based on the design performance specifications, such as operating voltage, current, frequency, and accuracy, select components that meet the requirements to ensure stable and reliable operation.
	
Reliability: Consider the reliability and lifespan of components during selection. Choose reputable suppliers and brands to ensure product stability and durability.
	
Cost-Effectiveness: While ensuring performance, consider the cost of components and select components with a high cost-performance ratio to make the product competitive.
	
Package Type: Select the appropriate package type based on the PCB layout and size limitations to ensure that components can be correctly mounted on the PCB and maintain good heat dissipation.
	
Supply Stability: Select components with a stable supply to ensure long-term supply support and avoid production delays caused by component shortages or production stoppages.
	
Compatibility: Ensure the selected components are compatible with other components and control boards to avoid instability or conflicts caused by compatibility issues.
	
Taking all the above factors into account, carefully select each component to ensure they are properly matched to meet design requirements and ultimately guarantee the stable performance and reliability of the paper shredder PCBA.
	
	
| Parameter | Capability | 
| Layers | 1-40 layers | 
| Assembly Type | Through-Hole (THT), Surface Mount (SMT), Mixed (THT+SMT) | 
| Minimum Component Size | 0201(01005 Metric) | 
| Maximum Component Size | 2.0 in x 2.0 in x 0.4 in (50 mm x 50 mm x 10 mm) | 
| Component Package Types | BGA, FBGA, QFN, QFP, VQFN, SOIC, SOP, SSOP, TSSOP, PLCC, DIP, SIP, etc. | 
| Minimum Pad Pitch | 0.5 mm (20 mil) for QFP, QFN, 0.8 mm (32 mil) for BGA | 
| Minimum Trace Width | 0.10 mm (4 mil) | 
| Minimum Trace Clearance | 0.10 mm (4 mil) | 
| Minimum Drill Size | 0.15 mm (6 mil) | 
| Maximum Board Size | 18 in x 24 in (457 mm x 610 mm) | 
| Board Thickness | 0.0078 in (0.2 mm) to 0.236 in (6 mm) | 
| Board Material | CEM-3,FR-2,FR-4, High-Tg, HDI, Aluminum, High Frequency, FPC, Rigid-Flex, Rogers, etc. | 
| Surface Finish | OSP, HASL, Flash Gold, ENIG, Gold Finger, etc. | 
| Solder Paste Type | Leaded or Lead-Free | 
| Copper Thickness | 0.5OZ – 5 OZ | 
| Assembly Process | Reflow Soldering, Wave Soldering, Manual Soldering | 
| Inspection Methods | Automated Optical Inspection (AOI), X-ray, Visual Inspection | 
| Testing Methods In-House | Functional Test, Probe Test, Aging Test, High and Low Temperature Test | 
| Turnaround Time | Sampling: 24 hours to 7 days, Mass Run: 10 - 30 days | 
| PCB Assembly Standards | ISO9001:2015; ROHS, UL 94V0, IPC-610E class ll | 
 
			1. Automatic solderpaste printing
 
			2. solderpaste printing done
 
			3. SMT pick and place
 
			4. SMT pick and place done
 
			5. ready for reflow soldering
 
			6. reflow soldering done
 
			7. ready for AOI
 
			8. AOI inspection process
 
			9. THT component placement
 
			10. wave soldering process
 
			11. THT assembly done
 
			12. AOI Inspection for THT assembly
 
			13. IC programming
 
			14. function test
 
			15. QC Check and Repair
 
			16. PCBA conformal coating Process
 
			17. ESD packing
 
			18. Ready for Shipping
 
	
 
	
 
	
 
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