WiFi Module PCBA

Product Description

What is WiFi Module PCBA ?

We want to take this opportunity to introduce you to our high-quality WiFi module PCBA at Unixplore Electronics. Our primary objective is to make sure that our customers fully comprehend the capabilities and features of our products. We are always eager to partner with our existing and new customers to foster a better future.

Wi Fi module, also known as serial port WiFi PCBA, belongs to the Internet of Things transmission layer. Its function is to convert the serial port or TTL level into an embedded module that complies with WiFi wireless network communication standards. It is equipped with the wireless network protocol IEEE802.11b.g.n protocol stack and TCP/IP protocol stack. Traditional hardware devices embedded with Wi Fi modules can directly connect to the Internet using Wi Fi, which is an important component of implementing IoT applications such as wireless smart homes and M2M, and is an important component of intelligent hardware.

Unixplore provides one-stop turnkey service for your Electronic Manufacturing project. Feel free to contact us for your circuit board assembly building, we can make a quotation in 24 hours after we receive your Gerber file and BOM list!

WiFi Module PCBA Manufacture

* Gerber file and BOM list supplied by client
* Blank PCB made, components purchased by us
* PCB fabrication with parts fully assembled
* 100% Function Tested OK before shipping
* RoHS compliant, Lead-free manufacturing process
* Quick delivery, with independent ESD package
* One stop electronic manufacturing service for PCB design, PCB layout, PCB manufacture, components procurement, PCB SMT and THT assembly, IC programming, function test, packaging and delivery

Unixplore PCB & PCB Assembly Capability

Parameter	Capability
Layers	1-40 layers
Assembly Type	Through-Hole (THT), Surface Mount (SMT), Mixed (THT+SMT)
Minimum Component Size	0201(01005 Metric)
Maximum Component Size	2.0 in x 2.0 in x 0.4 in (50 mm x 50 mm x 10 mm)
Component Package Types	BGA, FBGA, QFN, QFP, VQFN, SOIC, SOP, SSOP, TSSOP, PLCC, DIP, SIP, etc.
Minimum Pad Pitch	0.5 mm (20 mil) for QFP, QFN, 0.8 mm (32 mil) for BGA
Minimum Trace Width	0.10 mm (4 mil)
Minimum Trace Clearance	0.10 mm (4 mil)
Minimum Drill Size	0.15 mm (6 mil)
Maximum Board Size	18 in x 24 in (457 mm x 610 mm)
Board Thickness	0.0078 in (0.2 mm) to 0.236 in (6 mm)
Board Material	CEM-3,FR-2,FR-4, High-Tg, HDI, Aluminum, High Frequency, FPC, Rigid-Flex, Rogers, etc.
Surface Finish	OSP, HASL, Flash Gold, ENIG, Gold Finger, etc.
Solder Paste Type	Leaded or Lead-Free
Copper Thickness	0.5OZ – 5 OZ
Assembly Process	Reflow Soldering, Wave Soldering, Manual Soldering
Inspection Methods	Automated Optical Inspection (AOI), X-ray, Visual Inspection
Testing Methods In-House	Functional Test, Probe Test, Aging Test, High and Low Temperature Test
Turnaround Time	Sampling: 24 hours to 7 days, Mass Run: 10 - 30 days
PCB Assembly Standards	ISO9001:2015; ROHS, UL 94V0, IPC-610E class ll

Unixplore Value-Added Electronic Manufacturing Service

● IC pre-programming service with file in format of HEX,ELF and BIN.
● WiFi PCB Assembly Function test fixture customized according to client’s test requirements
● Box building service including plastic & metal case mold and part production
● Conformal coating including selective lacquer coating, epoxy resin potting
● Wire harness and cable assembly
● Finished product assembly including box, screen, membrane switch, labelling and customized carton or retail box packing.
● Various third-party tests for PCBA are available upon request
● Product Certification Assistance

PCBA Production Procedure