Product Description

How is the Smart Lamp PCBA produced?

To produce a smart lamp PCBA (Printed Circuit Board Assembly) controller, you will need to follow these general procedures as below:

Electrical Design: Start by designing the circuit schematic and layout for the smart lamp controller. This should include components such as microcontrollers, sensors, LED drivers, communication modules (e.g., Wi-Fi, Bluetooth), power management components, and other necessary elements.

PCB Fabrication: Once the design is finalized, create the PCB layout using PCB design software. After that, you can send the design files to a PCB fabrication service to produce the actual PCB.

Component Procurement: Procure all the required electronic components from reliable suppliers. Make sure to source high-quality components for better performance and reliability.

SMT & THT Assembly: Once you have the PCB and components ready, you can proceed with the assembly process. This involves soldering the components onto the PCB following the design layout. This can be done manually or through automated assembly machines such as SMT machine or DIP machine.

Chip Programming: If your smart lamp controller involves a microcontroller, you will need to program the firmware. This involves writing code to control the functionality of the smart lamp, such as adjusting brightness levels, color temperatures, and communication protocols.

Functional Testing: After assembling the PCB, perform thorough testing to ensure that the smart lamp controller functions as expected. Test the functionality of all components, connections, and features of the controller.

Enclosure Design and Assembly: If required, design an enclosure for the smart lamp controller to protect the PCB and components. Assemble the PCB into the enclosure following the design specifications.

Quality Control: Perform quality control checks to ensure that the smart lamp PCBA controllers meet quality standards and specifications.

Packaging and Distribution: Once the smart lamp controllers pass all tests and quality checks, package them properly for distribution to customers or retailers.

Please note that producing a smart lamp PCBA controller involves technical expertise in electronic design, assembly, programming, and quality control. If you are not familiar with these processes, it may be beneficial to seek assistance from professionals or companies specializing in PCB assembly and electronics manufacturing.

Unixplore provides one-stop turn-key service for your Electronic Manufacturing project. Feel free to contact us for your circuit board assembly building, we can make a quotation in 24 hours after we receive your Gerber file and BOM list!

Smart Lamp PCBA Manufacture

* Gerber file and BOM list supplied by client
* Blank PCB made, components purchased by us
* PCB fabrication with parts fully assembled
* 100% Function Tested OK before shipping
* RoHS compliant, Lead-free manufacturing process
* Quick delivery, with independent ESD package
* One stop electronic manufacturing service for PCB design, PCB layout, PCB manufacture, components procurement, PCB SMT and THT assembly, IC programming, function test, packaging and delivery

Unixplore PCB & PCB Assembly Capability

Parameter	Capability
Layers	1-40 layers
Assembly Type	Through-Hole (THT), Surface Mount (SMT), Mixed (THT+SMT)
Minimum Component Size	0201(01005 Metric)
Maximum Component Size	2.0 in x 2.0 in x 0.4 in (50 mm x 50 mm x 10 mm)
Component Package Types	BGA, FBGA, QFN, QFP, VQFN, SOIC, SOP, SSOP, TSSOP, PLCC, DIP, SIP, etc.
Minimum Pad Pitch	0.5 mm (20 mil) for QFP, QFN, 0.8 mm (32 mil) for BGA
Minimum Trace Width	0.10 mm (4 mil)
Minimum Trace Clearance	0.10 mm (4 mil)
Minimum Drill Size	0.15 mm (6 mil)
Maximum Board Size	18 in x 24 in (457 mm x 610 mm)
Board Thickness	0.0078 in (0.2 mm) to 0.236 in (6 mm)
Board Material	CEM-3,FR-2,FR-4, High-Tg, HDI, Aluminum, High Frequency, FPC, Rigid-Flex, Rogers, etc.
Surface Finish	OSP, HASL, Flash Gold, ENIG, Gold Finger, etc.
Solder Paste Type	Leaded or Lead-Free
Copper Thickness	0.5OZ – 5 OZ
Assembly Process	Reflow Soldering, Wave Soldering, Manual Soldering
Inspection Methods	Automated Optical Inspection (AOI), X-ray, Visual Inspection
Testing Methods In-House	Functional Test, Probe Test, Aging Test, High and Low Temperature Test
Turnaround Time	Sampling: 24 hours to 7 days, Mass Run: 10 - 30 days
PCB Assembly Standards	ISO9001:2015; ROHS, UL 94V0, IPC-610E class ll

Unixplore Value-Added Electronic Manufacturing Service

● IC pre-programming service with file in format of HEX,ELF and BIN.
● Smart Lamp PCBA Function test fixture customized according to client’s test requirements
● Box building service including plastic & metal case mold and part production
● Conformal coating including selective lacquer coating, epoxy resin potting
● Wire harness and cable assembly
● Finished product assembly including box, screen, membrane switch, labelling and customized carton or retail box packing.
● Various third-party tests for PCBA are available upon request
● Product Certification Assistance

PCBA Production Procedure